Position: Engineer (Bonding Process)
Responsibilities:
- Design process parameters, prepare engineering specifications documentation, and provide training to those involved in the process.
- Monitor, analyze, and evaluate the process's performance, quality, and cost-effectiveness.
- Monitor and control the process to ensure compliance with specifications, troubleshoot issues, improve processes, and evaluate quality in production.
- Analyze and evaluate new raw materials to reduce costs or improve quality levels.
- Install new machinery, troubleshoot issues, and improve machine efficiency (in collaboration with Machine Engineers).
- Analyze and evaluate quality issues, customer complaints, OQC (Outgoing Quality Control), and simulate defect occurrences.
- Analyze and make decisions regarding the management of non-conforming products.
Qualifications:
- Male or Female, Age 25 – 35 years old.
- Bachelor's degree Industrial Engineering, Electrical Engineer, Engineering or Materials Science, or other related fields.
- Experience in bonding processes (Die/Wire bond) in electronic device manufacturing, with proficiency in adjusting and troubleshooting Die/Wire bond machine parameters.
- Proficient in using computer programs such as Microsoft (Excel, PTT), Minitab and Auto Cad
- Good Command in English.